Micron, Samsung, and SK hynix have introduced their small outline compression attached memory modules (SOCAMM) that use LPDDR5X memory and are aimed at AI and low-power servers. OCAMMs — which will first be used with servers based on Nvidia’s GB300 Grace Blackwell Ultra Superchip systems
DeepSeek’s rollout into the Chinese consumer market continues, as Zhaoxin has announced its adoption of the DeepSeek-R1 LLM across its hardware lineup. Zhaoxin, one of the few Chinese companies licensed to work with the x86 instruction set, boasts that its processors and OEM systems can natively run the 1.5B, 7B, 14B, 32B, 70B, and 671B parameter models released by DeepSeek so far.
Nvidia is reportedly teaming up with memory manufacturers SK hynix, Micron and Samsung to create a new memory standard that’s both small in size, but big on performance, according to a report via SEDaily.
The new standard, named System On Chip Advanced Memory Module (SOCAMM) is in the works with all three large scale memory makers.
Reports suggest that AMD will debut its 16-core and 12-core Ryzen 9000X3D CPUs in late March, coinciding with the launch of its Radeon RX 9000 series graphics cards. Citing internal sources, French hardware news website CowCotLand claims that the Ryzen 9 9950X3D and Ryzen 9 9900X3D are planned for release by the end of Q1, aligning with AMD’s provided release timeframe.
In a not-so-unexpected turn of events, Intel is ending its 12th Generation Alder Lake mobile family. These include the standard Core i-series alongside select Pentium and Celeron models that leverage the Alder Lake architecture. No surprise here since Intel has employed more of the same silicon across the 13th Generation mobile, Core 100 (Series 1) and Core 200 (Series 2) families.
Over the past several days, multiple reports have emerged that various China-based third-party memory module makers have begun selling DDR5 DRAM sticks for enthusiasts based on DDR5 chips produced by the China-based ChangXin Memory Technologies (CXMT).
With less than one month left to CES 2025, leaked benchmarks have started to surface starring AMD’s flagship Strix Halo APUs. The Ryzen AI MAX+ Pro 395 – now that’s a mouthful – has emerged on Geekbench packing 16 CPU cores, 64GB of RAM, and a massive 40 CU (Compute Units) Radeon RX 8600S iGPU (Integrated GPU).
When Zhaoxin, a joint venture between Via Technologies and Shanghai Municipal Government, introduced its KaiXian KX-7000 series of x86 processors in late 2023, it implied that the new CPUs will offer tangible performance improvements over its predecessors as they were based on a brand-new microarchitecture.
Intel’s upcoming Core Ultra 5 225H from the Arrow Lake-H mobile family has been tested at Geekbench (via Benchleaks), delivering moderate uplifts compared to its predecessor in the CPU and iGPU (OpenCL) departments.