AMD’s whirlwind ride back into competitiveness in the semiconductor market has led to an unexpected process node advantage over Intel, with the 7nm process from TSMC, paired with the chiplet-based Zen architecture, bringing performance, power, and cost advantages over Intel’s competing chips.

Intel introduced its new lineup of Cascade Lake Refresh Xeon server parts today and they bring along remarkable price reductions compared to the existing Xeon lineup, with the top-line changes to the company’s flagship models amounting to a ~60% reduction in per-core pricing in exchange for the inability to scale beyond two sockets.

Gigabyte this week quietly listed its new Designare 64GB RAM kit, which offers that huge capacity spread out across only two DIMMs. With 32GB per module, this appeals mostly to professional creators with very memory-intensive tasks like video editing.

AMD and Intel were among the winners of the 2019 Analysts’ Choice Awards by The Linley Group for second-generation Epyc processors and Foveros packaging technology, respectively. Habana, Arm and Huawei also won awards.

Micron announced that it is sampling DDR5 registered DIMMs with its 1znm process technology to key industry partners. These ECC DIMMs are designed for server workloads and offer more than an 85% increase in performance, which comes along with lower power consumption, compared to their DDR4 counterparts.

In what seems to be an unprecedented move, even for Intel, Comet Lake might end up taking residence on not one, but two new sockets: Chip detective @momomo_us recently discovered a string in the latest version of CPU-Z that references the LGA1159 socket, which may complement the LGA1200 socket that we already know is coming for Comet Lake.

As spotted by Shaun Fosmark, Australian overclocker jordan.hyde99 has set a new world record in wPrime 1024M with AMD’s Ryzen 9 3900X processor. What’s fascinating is the fact that the AMD processor was running a much slower clock speed than the previous record holder, the Intel Core i9-7920X.

G.Skill has revealed a plethora of high-performance DDR4 RAM kits for the Intel X299 and AMD TRX40 platforms. The new memory kits hail from the brand’s Trident Z Royal and Trident Z Neo product lines and are tailored towards the latest Intel Cascade Lake-X and AMD Castle Peak-based high-end desktop (HEDT) processors, namely the AMD Threadripper 3970X and 3960X and Threadripper 3990X arriving in 2020.

As per a VideoCardz report citing Intel this week, Intel has reportedly baptized its future 7nm Xe graphics card after Ponte Vecchio, a stone bridge that overlooks the Arno River in Florence, Italy. Ponte Vecchio won’t be a gaming graphics card upon release, but will instead target exascale computing.