The engineers behind the AMD Instinct MI300A APU have published their research on crafting the future of “exascale heterogeneous processing.” The MI300A is the processor at the heart of El Capitan, which is expected to become the world’s fastest supercomputer when it begins operation this year. It is projected to run at two exaFLOPS.

SureCore announced its new SRAM modules for quantum computing SoCs that can function at cryogenic temperatures as low as 4 Kelvin (-269°C). The innovation comes as a major breakthrough for cooling and downsizing quantum computer data centers.

China’s homemade CPUs have not been very competitive compared to Western competitors, but that appears to be changing. According to IT Home, a desktop sporting a Hygon C86 3350 CPU was benchmarked by a Bilibili content creator on Geekbench, showing Zen 2 levels of performance.

ASML announced at imec’s ITF World 2024 conference that it has now set a new chipmaking density record with its first High-NA machine, surpassing a record it set just two months ago. ASML‘s former President and CTO, Martin van den Brink, who now serves in an advisory role at the company

Intel fired yet another salvo in the AI PC war today with claims that its Lunar Lake chips, which are on track for launch in Q3 2024, deliver 1.4x more AI performance than the Qualcomm Snapdragon X Elite chips that Microsoft showed off today.

AMD will be utilizing “slow” 18Gbps GDDR6 memory modules with its next generation “RX 8000-series” RDNA 4 GPU lineup, according to a post from prolific leaker Kepler on X (Twitter). If true, this will be the fourth RDNA architecture in a row to utilize GDDR6 memory.

Intel announced it’s finally bringing LGA1851 socket-compatible Core Ultra processors based on the Meteor Lake architecture to the market. But before you get your hopes up, these chips are targeted at edge computing rather than consumer desktops.

In a press release Adata has announced that from the second quarter of 2024 it will use a thermal coating technology on the PCB of its DDR5 memory modules. This coating is claimed to reduce temperatures by 8.5 degrees Celsius in Adata’s own tests, and offer a heat dissipation efficiency of more than 10%.

A Geekbench 6 result features what is likely the first-ever look at the single-core performance of the Taishan V120, developed by Huawei’s HiSilicon subsidiary (via @Olrak29_ on X). The single-core score indicates that Taishan V120 cores are roughly on par with AMD’s Zen 3 cores from late 2020, which could mean Huawei’s technology isn’t that far behind cutting-edge Western chip designers.