All makers of dynamic random access memory (DRAM) strive to develop process technologies that allow them to build the smallest memory cells possible to make their chips cheaper. But this is not exactly the best strategy for China-based ChangXin Memory Technologies (CXMT), which has to comply with export restrictions of the U.S. government.

AMD is gearing up to release its Ryzen 8000G-series accelerated processing units for desktops with built-in RDNA 3-based GPU, and the latter tend to be hungry for memory bandwidth. PCWorld decided to ask AMD whether users buying advanced versions of AMD’s next-generation desktop APUs should also buy expensive memory kits for their new rigs to avoid any performance bottlenecks for built-in Radeon GPUs.

An image of an unknown socket presumably designed for Intel’s processors has been published by @Yuuki_Ans, a renowned hardware leaker. The socket in question is called LGA4710 and might be destined for special-use processors from Intel or custom ‘off roadmap’ system-on-chip designs.

The published images depict a socket entitled ‘LGA4710-2’ and ‘LGA-4677 LGA-4710.’ Lotes, a major maker of CPU sockets and other connectors, manufactured the socket.

Intel’s upcoming Sierra Forest server chip has leaked onto Geekbench 6 with impressive multi-core performance (via BenchLeaks). Sierra Forest comes with up to 144 efficiency cores, and it’s slated to arrive in the first half of 2024.

This week, two memory makers — G.Skill and v-color — formally announced their quad-channel memory module kits for AMD Ryzen Threadripper 7000-series processors. The new ECC-enabled RDIMM kits with AMD EXPO profiles are factory-overclocked and top at 6400 MT/s and 7200 MT/s speed bins.

Intel has announced the company’s “AI Everywhere” event, where it’ll unveil the company’s long-awaited Intel Core Ultra (Meteor Lake) and 5th Generation Xeon (Emeralds Rapids) processors. The chipmaker has scheduled the live keynote for December 14 at 10 a.m. EST (7 a.m. PST).

Socionext, a custom chip developer from Japan, has announced one of the industry’s first 32-core datacenter-grade chiplets, which is set to be made on TSMC’s 2nm-class fabrication process. The proof-of-concept chiplet could be used for a wide variety of applications, including cloud datacenters, edge servers, 5G/6G infrastructure, and data processing units.

YouTube channel Moore’s Law Is Dead leaked two new allegedly official AMD slides detailing key specifications and IPC targets for Zen 5 and Zen 6. The new slides report that Zen 5 will be a significant architectural overhaul over Zen 4, targeting 10 to 15% IPC improvements or more.

Samsung today announced that it has developed a Low Power Compression Attached Memory Module (LPCAMM) lineup that leverages LPDDR5X memory in a smaller, faster, and more efficient package than standard memory. Samsung says the new LPDDR5X-6400 modules deliver up to 7.5 gigabits-per-second of memory throughput and consume 60% less board space while delivering 50% more performance than current SO-DIMM memory modules.