When Zhaoxin, a joint venture between Via Technologies and Shanghai Municipal Government, introduced its KaiXian KX-7000 series of x86 processors in late 2023, it implied that the new CPUs will offer tangible performance improvements over its predecessors as they were based on a brand-new microarchitecture.
Intel’s upcoming Core Ultra 5 225H from the Arrow Lake-H mobile family has been tested at Geekbench (via Benchleaks), delivering moderate uplifts compared to its predecessor in the CPU and iGPU (OpenCL) departments.
Micron has launched new DDR5-6400 memory kits to compete with the best RAM money can buy. However, these are normal UDIMMs and should not be confused with the DDR5-6400 CUDIMMs that hit the retail market earlier this month.
When it comes to performance in gaming benchmarks, AMD’s Ryzen 9000-series does not exactly impress, due to the mediocre improvements observed over predecessors. s. Nevertheless, enthusiasts have kept alight higher hopes for the 3D V-Cache enabled Ryzen 9000X3D-series processors, expecting them to deliver a worthwhile performance uplift in games.
Intel announced the on-time launch of its high-performance Xen 6 ‘Granite Rapids’ 6900P-series models today, with five new models spanning from 72 cores up to 128 cores, finally exceeding the core counts of AMD’s existing EPYC models for the first time since 2017, and even matching the core counts of AMD’s soon-to-be-launched Zen 5 Turin processors.
In a Q&A session that Tom’s Hardware attended at IFA 2024, AMD revealed that the next generation of its Ryzen handheld gaming processor, AMD Ryzen Z2 Extreme, will arrive early next year. The Z2 Extreme is the successor to AMD’s current Z1 Extreme, which powers devices like the ROG Ally X and Legion Go.
MSI has unveiled a new homebrewed performance-boosting feature called PBO Enhanced Mode. This feature purportedly improves AMD’s Ryzen 9000 chips, which compete with the best CPUs. MSI’s iteration is seemingly an improved version of AMD’s PBO2.
Samsung has started mass production of the world’s thinnest LPDDR5X DRAM packages featuring 12 GB and 16 GB capacities. These new products feature a thickness of around 0.65 mm, which is 0.06 mm thinner than typical LPDDR5X packages.
Intel has reportedly increased the maximum thermal junction (TJMax) temperature for its upcoming codenamed Arrow Lake and Panther Lake processors to 105 degrees Celsius, according to a leak by Jaykihn. Jaykihn is a blogger who seems to have access to samples of Intel’s upcoming processors and not-yet-released documents.