As per a VideoCardz report citing Intel this week, Intel has reportedly baptized its future 7nm Xe graphics card after Ponte Vecchio, a stone bridge that overlooks the Arno River in Florence, Italy. Ponte Vecchio won’t be a gaming graphics card upon release, but will instead target exascale computing.

We opined that AMD’s last quarterly earnings represented the calm before the 7nm storm, and today that storm made landfall as AMD posted its highest quarterly revenue since 2005 driven by its highest quarterly revenue for client (desktop) PC chips since 2011.

If anyone is known for making ludicrous memory kits (but also great mainstream memory), it’s G.Skill. Today, the Taiwanese manufacturer announced specifications for its new 32GB DDR4 modules, which will come in kits with up to eight modules for a grand total memory capacity of up to 256GB.

AMD announced its Ryzen PRO lineup, which is tailored for professional users, with little fanfare today. The new lineup is now globally available and includes Ryzen 3000 series models with Radeon Vega graphics along with AMD Athlon PRO models.

Intel might be planning on launching a cut-down version of the Xeon W-3175X, the 28-core HEDT flagship that it launched almost a year ago. It’s the only CPU available for the C621 chipset that uses the LGA 3647 socket, and currently, there are only two motherboards available for the C621 chipset.

Intel announced eight new Comet Lake processors for the mobile market. These new processors come in U- and Y-Series models for laptops and 2-in-1 designs and slot into the 10th Generation Core series, bumping up the U-series from four to six cores and the Y-series from two cores to four.

Gigabyte has put up the product page for the brand’s latest MZ32-AR0 motherboard which contains the SKU list and block diagram for AMD’s EPYC (Rome) processors that are set to debut later today.

Corsair today launched a new group of Vengeance LPX modules based on 16Gb (2GB) ICs, making capacities from 1x 32GB to 8x 32GB (256GB) available to anyone with the firmware to support it.

Intel revealed three new packaging technologies at SEMICON West: Co-EMIB, Omni-Directional Interconnect (ODI) and Multi-Die I/O (MDIO). These new technologies enable massive designs by stitching together multiple dies into one processor. Building upon Intel’s 2.5D EMIB and 3D Foveros tech, the technologies aim to bring near-monolithic power and performance to heterogeneous packages.