Corsair today launched a new group of Vengeance LPX modules based on 16Gb (2GB) ICs, making capacities from 1x 32GB to 8x 32GB (256GB) available to anyone with the firmware to support it.

Intel revealed three new packaging technologies at SEMICON West: Co-EMIB, Omni-Directional Interconnect (ODI) and Multi-Die I/O (MDIO). These new technologies enable massive designs by stitching together multiple dies into one processor. Building upon Intel’s 2.5D EMIB and 3D Foveros tech, the technologies aim to bring near-monolithic power and performance to heterogeneous packages.