A detailed breakdown of AMD’s planned CPU releases has been shared by leakers Olrak and InstLatX64, via VideoCardz. These upcoming products span across the desktop, mobile, and workstation designations. All these will employ the same Zen 5 architecture, and most appear to be refreshes of current offerings.
Shipping documents sourced from NBD.ltd purport that Intel might switch to the LGA1954 platform for its next-generation Nova Lake processors on desktop (via Olrak). This is accompanied by PCH tooling likely intended for the 900-series chipsets. Importantly, these listings do not indicate an imminent launch, especially since Nova Lake has officially been confirmed as a 2026 product.
Micron, Samsung, and SK hynix have introduced their small outline compression attached memory modules (SOCAMM) that use LPDDR5X memory and are aimed at AI and low-power servers. OCAMMs — which will first be used with servers based on Nvidia’s GB300 Grace Blackwell Ultra Superchip systems
AMD’s upcoming Zen 6 processors will remain compatible with AM5, but they are set to introduce a new chiplet-based CPU design and significantly boost core counts across desktop and laptop products, according to sources of ChipHell, as well as Moore’s Law Is Dead. Premium processors for gamers will also feature 3D V-Cache.
DeepSeek’s rollout into the Chinese consumer market continues, as Zhaoxin has announced its adoption of the DeepSeek-R1 LLM across its hardware lineup. Zhaoxin, one of the few Chinese companies licensed to work with the x86 instruction set, boasts that its processors and OEM systems can natively run the 1.5B, 7B, 14B, 32B, 70B, and 671B parameter models released by DeepSeek so far.
Nvidia is reportedly teaming up with memory manufacturers SK hynix, Micron and Samsung to create a new memory standard that’s both small in size, but big on performance, according to a report via SEDaily.
The new standard, named System On Chip Advanced Memory Module (SOCAMM) is in the works with all three large scale memory makers.
Reports suggest that AMD will debut its 16-core and 12-core Ryzen 9000X3D CPUs in late March, coinciding with the launch of its Radeon RX 9000 series graphics cards. Citing internal sources, French hardware news website CowCotLand claims that the Ryzen 9 9950X3D and Ryzen 9 9900X3D are planned for release by the end of Q1, aligning with AMD’s provided release timeframe.
In a not-so-unexpected turn of events, Intel is ending its 12th Generation Alder Lake mobile family. These include the standard Core i-series alongside select Pentium and Celeron models that leverage the Alder Lake architecture. No surprise here since Intel has employed more of the same silicon across the 13th Generation mobile, Core 100 (Series 1) and Core 200 (Series 2) families.
Over the past several days, multiple reports have emerged that various China-based third-party memory module makers have begun selling DDR5 DRAM sticks for enthusiasts based on DDR5 chips produced by the China-based ChangXin Memory Technologies (CXMT).