Intel announced the on-time launch of its high-performance Xen 6 ‘Granite Rapids’ 6900P-series models today, with five new models spanning from 72 cores up to 128 cores, finally exceeding the core counts of AMD’s existing EPYC models for the first time since 2017, and even matching the core counts of AMD’s soon-to-be-launched Zen 5 Turin processors.

In a Q&A session that Tom’s Hardware attended at IFA 2024, AMD revealed that the next generation of its Ryzen handheld gaming processor, AMD Ryzen Z2 Extreme, will arrive early next year. The Z2 Extreme is the successor to AMD’s current Z1 Extreme, which powers devices like the ROG Ally X and Legion Go.

MSI has unveiled a new homebrewed performance-boosting feature called PBO Enhanced Mode. This feature purportedly improves AMD’s Ryzen 9000 chips, which compete with the best CPUs. MSI’s iteration is seemingly an improved version of AMD’s PBO2.

Samsung has started mass production of the world’s thinnest LPDDR5X DRAM packages featuring 12 GB and 16 GB capacities. These new products feature a thickness of around 0.65 mm, which is 0.06 mm thinner than typical LPDDR5X packages.

Intel has reportedly increased the maximum thermal junction (TJMax) temperature for its upcoming codenamed Arrow Lake and Panther Lake processors to 105 degrees Celsius, according to a leak by Jaykihn. Jaykihn is a blogger who seems to have access to samples of Intel’s upcoming processors and not-yet-released documents.

The engineers behind the AMD Instinct MI300A APU have published their research on crafting the future of “exascale heterogeneous processing.” The MI300A is the processor at the heart of El Capitan, which is expected to become the world’s fastest supercomputer when it begins operation this year. It is projected to run at two exaFLOPS.

SureCore announced its new SRAM modules for quantum computing SoCs that can function at cryogenic temperatures as low as 4 Kelvin (-269°C). The innovation comes as a major breakthrough for cooling and downsizing quantum computer data centers.

China’s homemade CPUs have not been very competitive compared to Western competitors, but that appears to be changing. According to IT Home, a desktop sporting a Hygon C86 3350 CPU was benchmarked by a Bilibili content creator on Geekbench, showing Zen 2 levels of performance.

ASML announced at imec’s ITF World 2024 conference that it has now set a new chipmaking density record with its first High-NA machine, surpassing a record it set just two months ago. ASML‘s former President and CTO, Martin van den Brink, who now serves in an advisory role at the company