In a press release Adata has announced that from the second quarter of 2024 it will use a thermal coating technology on the PCB of its DDR5 memory modules. This coating is claimed to reduce temperatures by 8.5 degrees Celsius in Adata’s own tests, and offer a heat dissipation efficiency of more than 10%.

A Geekbench 6 result features what is likely the first-ever look at the single-core performance of the Taishan V120, developed by Huawei’s HiSilicon subsidiary (via @Olrak29_ on X). The single-core score indicates that Taishan V120 cores are roughly on par with AMD’s Zen 3 cores from late 2020, which could mean Huawei’s technology isn’t that far behind cutting-edge Western chip designers.

Intel has disclosed a whopping 34 security vulnerabilities, contained within 32 pieces of software and two kinds of firmware. The 32 software security bugs broadly impact drivers for chipsets, Wi-Fi, and other components, and also include applications such as XTU, the oneAPI Toolkit, and Intel Unison

All makers of dynamic random access memory (DRAM) strive to develop process technologies that allow them to build the smallest memory cells possible to make their chips cheaper. But this is not exactly the best strategy for China-based ChangXin Memory Technologies (CXMT), which has to comply with export restrictions of the U.S. government.

AMD is gearing up to release its Ryzen 8000G-series accelerated processing units for desktops with built-in RDNA 3-based GPU, and the latter tend to be hungry for memory bandwidth. PCWorld decided to ask AMD whether users buying advanced versions of AMD’s next-generation desktop APUs should also buy expensive memory kits for their new rigs to avoid any performance bottlenecks for built-in Radeon GPUs.

An image of an unknown socket presumably designed for Intel’s processors has been published by @Yuuki_Ans, a renowned hardware leaker. The socket in question is called LGA4710 and might be destined for special-use processors from Intel or custom ‘off roadmap’ system-on-chip designs.

The published images depict a socket entitled ‘LGA4710-2’ and ‘LGA-4677 LGA-4710.’ Lotes, a major maker of CPU sockets and other connectors, manufactured the socket.

Intel’s upcoming Sierra Forest server chip has leaked onto Geekbench 6 with impressive multi-core performance (via BenchLeaks). Sierra Forest comes with up to 144 efficiency cores, and it’s slated to arrive in the first half of 2024.

This week, two memory makers — G.Skill and v-color — formally announced their quad-channel memory module kits for AMD Ryzen Threadripper 7000-series processors. The new ECC-enabled RDIMM kits with AMD EXPO profiles are factory-overclocked and top at 6400 MT/s and 7200 MT/s speed bins.

Intel has announced the company’s “AI Everywhere” event, where it’ll unveil the company’s long-awaited Intel Core Ultra (Meteor Lake) and 5th Generation Xeon (Emeralds Rapids) processors. The chipmaker has scheduled the live keynote for December 14 at 10 a.m. EST (7 a.m. PST).