Intel announced eight new Comet Lake processors for the mobile market. These new processors come in U- and Y-Series models for laptops and 2-in-1 designs and slot into the 10th Generation Core series, bumping up the U-series from four to six cores and the Y-series from two cores to four.

Gigabyte has put up the product page for the brand’s latest MZ32-AR0 motherboard which contains the SKU list and block diagram for AMD’s EPYC (Rome) processors that are set to debut later today.

Corsair today launched a new group of Vengeance LPX modules based on 16Gb (2GB) ICs, making capacities from 1x 32GB to 8x 32GB (256GB) available to anyone with the firmware to support it.

Intel revealed three new packaging technologies at SEMICON West: Co-EMIB, Omni-Directional Interconnect (ODI) and Multi-Die I/O (MDIO). These new technologies enable massive designs by stitching together multiple dies into one processor. Building upon Intel’s 2.5D EMIB and 3D Foveros tech, the technologies aim to bring near-monolithic power and performance to heterogeneous packages.